yalealumnimagazine.com  
  findings  
spacer spacer spacer
 
rule
  yalealumnimagazine.com
about the Yale Alumni Magazine
classified & display advertising
address changes
The Yale Classifieds
support us
write a letter to the editor

spacer
 
current issue

current issue
issue archives

 

advertise demographics
request a media kit
view The Yale Classifieds
place a classified ad

 

The Yale Alumni Magazine is owned and operated by Yale Alumni Publications, Inc., a nonprofit corporation independent of Yale University.

The content of the magazine and its website is the responsibility of the editors and does not necessarily reflect the views of Yale or its officers.

 

Comment on this article

Bonding

An exotic new species of coral? No, the strange form below is actually an engineering innovation—seen in microscopic close-up—that may help green the electronics industry: a strong, inexpensive solder to replace traditional lead-based solders.

©Joshua Calabro ’07

Lead is a potent neurotoxin. “Japan and the EU won’t allow electronic products that contain lead across their borders,” says mechanical engineering professor Ainissa Ramirez, who developed the new material, “and we’re moving away from its use in this country.” But the most popular lead-free alternative, a tin-silver alloy, is weaker and does not perform as well.

So when Joshua Calabro ’07 was searching for a senior thesis project, Ramirez asked him to try mixing tiny particles of iron with tin and silver. The eventual result, described in Proceedings of the National Academy of Sciences, is a strong material that can be melted and then easily and cheaply channeled with a magnet to connect transistors, chips, and other components. “This is not your father’s solder,” says Ramirez. “Or your mother’s.”  the end

 
 
 
spacer
 

©1992–2012, Yale Alumni Publications, Inc. All rights reserved.

Yale Alumni Magazine, P.O. Box 1905, New Haven, CT 06509-1905, USA. yam@yale.edu