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Bonding
May/June 2010
An
exotic new species of coral? No, the strange form below is actually an
engineering innovation—seen in microscopic close-up—that may help green the electronics
industry: a strong, inexpensive solder to replace traditional lead-based
solders.

©Joshua Calabro ’07
Lead
is a potent neurotoxin. “Japan and the EU won’t allow electronic products that
contain lead across their borders,” says mechanical engineering professor
Ainissa Ramirez, who developed the new material, “and we’re moving away from
its use in this country.” But the most popular lead-free alternative, a
tin-silver alloy, is weaker and does not perform as well.
So
when Joshua Calabro ’07 was searching for a senior thesis project, Ramirez
asked him to try mixing tiny particles of iron with tin and silver. The
eventual result, described in Proceedings of the National Academy of Sciences, is a strong material that can
be melted and then easily and cheaply channeled with a magnet to connect
transistors, chips, and other components. “This is not your father’s solder,”
says Ramirez. “Or your mother’s.”  |
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